Our Manufacturing & Technical Capabilities

Technical Process Specifications

Board Thickness

0.70mm ~ 1.60mm (±0.13mm)

Copper Foil Thickness

1oz or 2oz (35μ or 70μ)

Min. Line Width/Spacing

150μm / 180μm (0.15mm / 0.18mm)

Drilling Capabilities

Mold Hole (FR-1): 0.6mm+0.1/-0mm
CNC Drilling (FR-1/CEM-1): 0.3mm+0.05/-0mm

Surface Treatment

OSP, Flux, Lead-free HAL (Tin Spraying)

Max. Printing Dimensions

610mm x 510mm

Material Expertise

We work with all major UL-certified board materials:

Paper Board / FR-1 Series

KB, Eternal, CCP, Panasonic

Semi-Fiberglass Board / CEM-1 Series

Eternal, KB, Shengyi, CCP

Fiberglass Board / CEM-3 & FR-4

NanYa, KB, Shengyi, Panasonic

Our Quality Assurance System

100% Electrical Testing

Flying probe and dedicated testers ensure no open/short circuits.

Automated Optical Inspection (AOI)

Real-time monitoring to prevent defects.

Advanced Surface Treatment

New tin spraying and OSP/-FLUX lines installed

Precision Laboratory

Equipped with RoHS, film thickness, and 3D measurement systems for rigorous validation.